Our work goes well beyond the bonder, connecting a circuit to an interface using very fine wire.
We connect technologies for different processes or applications in communication, distance learning, medical, internet of things, cellular systems, and handsets for first responders.
Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) using bonding wires, which are fine wires made of gold or aluminum and silicon. At Semi-Conn NE we use Hesse Mechatronics automatic bonding systems and can bond to an array of chip technologies and interfaces.
